semiconductor manufacturing - translation to English
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semiconductor manufacturing - translation to English

MANUFACTURING PROCESS USED TO CREATE INTEGRATED CIRCUITS
Semiconductor manufacturing; Fabrication (semiconductor); Silicon chip fabrication; Integrated circuit fabrication; Chip fabrication; Semiconductor fabrication; Semiconductor Manufacturing; IC assembly; Semiconductor manufacturing equipment; Fab process; Semiconductor growth; Fabrication process; Semiconductor manufacturing processes; CPU fabrication; CPU manufacturing; Semiconductor node; Node (semiconductor fabrication); Technology node; Semiconductor process technology; Process node; Semiconductor manufacturing process; Semiconductor fabrication process; Minimum feature size; Process size; Integrated circuit manufacturing; History of semiconductor device fabrication; Device yield; Yield (semiconductor)

semiconductor manufacturing         

общая лексика

производство полупроводников

Смотрите также

FAB; semiconductor; wafer

semiconductor device         
  • An n–p–n bipolar junction transistor structure
  • A stylized replica of the first transistor
  • Operation of a [[MOSFET]] and its Id-Vg curve. At first, when no gate voltage is applied. There is no inversion electron in the channel, the device is OFF. As gate voltage increase, the inversion electron density in the channel increase, the current increases, and the device turns on.
ELECTRONIC COMPONENT THAT EXPLOITS THE ELECTRONIC PROPERTIES OF SEMICONDUCTOR MATERIALS
Semiconductor devices; Semiconductor device physics; Semiconductor Devices; Semiconductor electronics; Semiconductor component; History of semiconductor device development

общая лексика

полупроводниковое устройство

электронное устройство, основные характеристики которого обусловлены прохождением тока через полупроводник

полупроводниковый прибор

Смотрите также

semiconductor

semi-conducting         
  • [[John Bardeen]], [[William Shockley]] and [[Walter Brattain]] developed the bipolar [[point-contact transistor]] in 1947.
  • [[Karl Ferdinand Braun]] developed the [[crystal detector]], the first [[semiconductor device]], in 1874.
  • ingot]] of [[monocrystalline silicon]]
  • [[Silicon]] crystals are the most common semiconducting materials used in [[microelectronics]] and [[photovoltaics]].
MATERIAL THAT HAS ELECTRICAL CONDUCTIVITY INTERMEDIATE TO THAT OF A CONDUCTOR AND AN INSULATOR
Semiconductors; Semi-Conductors; Semi-conductor; Semiconductor physics; Semiconducting material; List of semiconductor devices; Semiconductor material; Semiconducting; Semi conductor; Semiconductive; Electronic Materials; Semiconduction; Semicon; Electronic materials; Semi-conducting; Semiconductivity; Semi conductors; Physics of semiconductors; Electronic substance

общая лексика

полупроводниковый

Definition

Тоёта Мотор
("Тоёта Мо́тор")

Wikipedia

Semiconductor device fabrication

Semiconductor device fabrication is the process used to manufacture semiconductor devices, typically integrated circuits (ICs) such as computer processors, microcontrollers, and memory chips (such as NAND flash and DRAM) that are present in everyday electrical and electronic devices. It is a multiple-step photolithographic and physico-chemical process (with steps such as thermal oxidation, thin-film deposition, ion-implantation, etching) during which electronic circuits are gradually created on a wafer, typically made of pure single-crystal semiconducting material. Silicon is almost always used, but various compound semiconductors are used for specialized applications.

The fabrication process is performed in highly specialized semiconductor fabrication plants, also called foundries or "fabs", with the central part being the "clean room". In more advanced semiconductor devices, such as modern 14/10/7 nm nodes, fabrication can take up to 15 weeks, with 11–13 weeks being the industry average. Production in advanced fabrication facilities is completely automated and carried out in a hermetically sealed nitrogen environment to improve yield (the percent of microchips that function correctly in a wafer), with automated material handling systems taking care of the transport of wafers from machine to machine. Wafers are transported inside FOUPs, special sealed plastic boxes. All machinery and FOUPs contain an internal nitrogen atmosphere. The insides of the processing equipment and FOUPs is kept cleaner than the surrounding air in the cleanroom. This internal atmosphere is known as a mini-environment. Fabrication plants need large amounts of liquid nitrogen to maintain the atmosphere inside production machinery and FOUPs, which are constantly purged with nitrogen.

Examples of use of semiconductor manufacturing
1. Carl Zeiss makes semiconductor manufacturing gear.
2. Top technology companies in Japan and Taiwan, including Canon, Hitachi, Sony, Taiwan Semiconductor Manufacturing Co.
3. Taiwan Semiconductor Manufacturing, the world‘s largest supplier of made–to–order chips, declined 1 percent, to 57.50 Taiwan dollars.
4. The declared goal of the acquisition is to form the largest company semiconductor manufacturing vendor, using unique technologies.
5. However, China‘s capital spending on semiconductor manufacturing equipment is expected to grow significantly over the next few years. Last year, new semiconductor manufacturing equipment sales in China were $2.73 billion. The United States currently supplies about 50 percent of this growing market. This presents an opportunity for the U.S. semiconductor manufacturing equipment industry in both sales and as a means to finance future R&D in the United States and maintain technology leadership.
What is the Russian for semiconductor manufacturing? Translation of &#39semiconductor manufacturing&